FEASIBILITY STUDY:
We carefully listen to and analyze all customer design ideas, providing comprehensive consulting with the ultimate goal of developing the requested system architecture, followed by the prototyping phase.
HARDWARE DESIGN:
We design hardware systems that meet customer specifications, producing functional schematics and the related Bill of Materials (BOM).
This service also includes the analysis of existing designs for improvements or modifications, as well as technical support for customer-developed projects.
SPICE ANALYSIS:
Electrical analysis of schematics developed either by HTS or by the customer, supported by detailed numerical and graphical results.
PCB LAYOUT DESIGN:
Design of the printed circuit board based on the schematic and BOM.
Our layout process considers all project requirements, including current levels, voltage differences, operating temperatures, dimensional and mechanical constraints, and I/O interface positioning.
PROJECT DATA PACKAGE CREATION:
Preparation of the complete set of final project documentation required for product
manufacturing. This service is also available for projects developed outside HTS.
POST-LAYOUT THERMAL ANALYSIS:
Simulation of PCB behavior under normal operating conditions to identify potential thermal
issues that may require layout optimization and/or the integration of thermal management
solutions.
POST-LAYOUT ELECTRICAL ANALYSIS:
Simulation of the PCB layout to evaluate electrical parameters such as parasitic RLC values,
single-ended and differential impedance, resonance phenomena, unwanted electric and
magnetic fields, and high-frequency signal integrity.
NEW PRODUCT INTRODUCTION:
By working directly with the customer’s design team, we guide new products through every phase, from development to final product, ensuring high-quality and innovative manufacturing processes.
BOX BUILDING:
Our box-building service is designed for customers seeking full production outsourcing, covering not only the electronic board but also mechanical, metal, and plastic components of the finished product.
FAST PROTOTYPING:
We use advanced technologies to create precise and efficient prototypes, allowing customers to test and refine their concepts quickly. Our extensive experience accelerates development cycles, reduces lead times, and ensures high-quality results.
IMPROVEMENT PROPOSALS:
Our expert team proposes innovative solutions to enhance efficiency, functionality, and sustainability in terms of design, materials, and manufacturing processes, maximizing final product performance.
With a continuous-improvement approach, each prototype iteration represents a step toward excellence.
SURFACE MOUNT TECHNOLOGY:
Three fully automated production lines with a capacity of approximately 90,000 components/hour, capable of assembling 0050025 chips and BGA packages with 0.15 mm pitch, equipped with:
1. Screen Printer / Jet Printer
2. 3D SPI
3. Pick & Place
4. Reflow Oven:
- 16 zones (8 top + 8 bottom)
- Vacuum technology
- Inert nitrogen atmosphere
5. 3D AOI
6. 3D X-Ray
THROUGH HOLE TECHNOLOGY:
Manual and automated THT assembly using both Sn/Pb and lead-free alloys:
- N°4 manual soldering stations
- N°1 selective soldering machine
- N°1 dual-wave soldering machine
THERMAL STRESS TESTING:
We simulate and evaluate the effects of extreme environmental conditions on electronic boards to ensure durability, reliability, and long-term performance under real world conditions, using:
- N°2 climatic chambers
- N° 2 baking ovens
- N°1 thermal shock chamber
PRE AND POST ASSEMBLY INSPECTION:
Quality control is the cornerstone of our manufacturing process and is performed both by specialized operators and advanced inspection technologies, including:
- 3D SPI
- 3D AOI
- Flying Probe Pilot V8 Next
- 3D X-Ray
FUNCTIONAL TESTING:
Based on customer-defined testing procedures, we apply stimulus signals to the BUT (Board Under Test) and perform precise measurements.
POWER TESTING:
According to the customer’s testing procedures, we apply power signals to bring the system to steady-state operation and measure critical parameters such as output power, THD, power factor, efficiency, and more.
IN-CIRCUIT TESTING:
With the availability of ODB++ files, we provide functional testing of the BUT with up to 100% coverage.
The flying probe performs component-level and subsystem-level testing, accurately identifying any potential issues.
Test Equipment:
- Signal Generator
- AC Source
- DC Source
- Power Analyzer
- Electronic Load
- Oscilloscope
- Differential Probes
- Current Probes
- Flying Probe V8 Next
- Multimeters
- Tagarno Microscope
- Vision Dynascope Microscope
- Microcontroller Programmers
REVERSE ENGINEERING:
A comprehensive analysis of the functions, applications, layout, design, geometry, and materials of electronic boards when original documentation is unavailable. Through a structured process, starting from the physical board, we reconstruct the
schematic and BOM.
CONFORMAL COATING:
Application of a thin polymer, acrylic, or silicone film to protect PCBs and components from environmental exposure and prevent corrosion.
UNDERFILL:
Application of epoxy material to fill gaps between a chip and its substrate or between a finished package and the PCB. Underfill protects electronics from shocks, drops, and vibrations and reduces stress on solder joints caused by thermal expansion differences.
REBALLING:
A process that restores BGA components by removing them from the PCB, cleaning residual solder, and reconstructing the BGA with new solder balls.
POTTING:
Partial or complete encapsulation of electronic components or assemblies using resin materials (such as silicone) to provide protection, electrical insulation, and thermal dissipation.
MARKING:
Using both laser and inkjet marking systems, we offer complete PCB marking services, from simple logo engraving to full serial numbering using alphanumeric codes or QR codes.
PCB CLEANING:
An effective process for removing solder paste residues from stencils and PCBs, as well as eliminating adhesive, flux residues, and contaminants from SMT and THT assemblies.
